Cooler Master ThermalFusion 400 High Performance Thermal Compound
Product Description
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Features:
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Curing
- Non-Corrosive
- Easy Application with Included Razor Blade
Specifications:
Model |
RG-TF4-TGU1-GP |
Color |
Gray |
Specific Gravity |
3.5 |
Thermal Conductivity |
2.89 (W/m-K) |
Volume Resistivity |
2.0E+10 (ohm-cm) |
BLT (Bond Line Thickness) |
0.008 (mm) |
Volatile content |
<0.1 (%) |
Thermal Resistance |
0.032 (degree Celsius-cm2/W) |
Weight |
4g |
UPC Code |
884102002687 |